High integration, high efficiency architecture, in the design of power supply without the use of heat sink

Oct 11, 2022|

Thanks to this highly integrated and efficient architecture, the design of high-power power supply can be done without the use of heat sink, while also meeting the PC power supply 80 PLUS titanium standard requirements.

The HiPERPDS-5 plus HiperLCS-2 chipset power solution is suitable for TV sets, displays with USB PD ports, electric vehicles, power tools, printers, projectors, power adapters, PC mainframe power supplies, game consoles, and 240W power consumption home appliance applications. As can be seen from the picture of 220W power PCB board on the right, in addition to the three chips of PI, the number of components on the PCB board is extremely simplified, which reduces the difficulty of high-power power supply design and accelerates the mass production of new products.

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