The effect of warpage and board on the quality of the weld.

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The effect of warpage and board on the quality of the weld.

Circuit boards and components warp during soldering, while defects such as solder joints and short circuits are caused by stress distortion.

Warpage is usually caused by temperature imbalance between the top and bottom of the board. For large PCBs, warpage may occur due to the weight of the board itself. A typical PBGA device is about 0.5 mm from the printed circuit board. If the device on the board is large, it will return to its normal shape when the board is cooled, and the solder joint will withstand stress for a long time. It is sufficient to lift the device by 0.1 mm. Open welding.

The layout is easy to control the soldering, but the board size is too large, but the printed line is long, the impedance is increased, the noise resistance is reduced, and the cost is increased. If the board size is too small, heat dissipation will be reduced, it is difficult to control the soldering, and adjacent areas are more likely to occur. Lines can interfere with each other, such as electromagnetic interference on the board. Therefore, it is necessary to optimize the design of the PCB board.

(1) Shorten the wiring between high frequency components to reduce EMI interference.

(2) Heavier components (eg, more than 20g) should be secured with brackets prior to soldering.

(3) The heating element should consider the heat dissipation problem, avoid large ΔT defects and rework on the surface of the component, and the heat sensitive component should be away from the heat source.

(4) The component arrangement is as parallel as possible, so it is not only beautiful, but also easy to solder, and must be mass-produced. The board is designed for an optimal 4:3 rectangle. Do not change the line width to avoid discontinuous wiring. When the substrate is heated for a long time, the copper foil is easily expanded. Therefore, please avoid large areas of copper foil.