BGA ball placement program
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BGA ball placement program
The specific steps of the "solder paste" + "tin ball" method are as follows.
1. Prepare tools for ball placement. To avoid rolling the ball, the ball must be washed and dried with alcohol.
2. Place the finished chips on the ball placement board.
3. The solder paste melts naturally and mixes evenly on the blade.
4. Place the solder paste on the positioning base and print the solder paste. The fingerprint needs to control the angle, strength and pulling speed of the hand cream. After finishing, gently remove the solder paste frame.
5. Make sure that each pad of the BGA is uniformly printed with solder paste, place the solder ball frame, place the solder balls, shake the ball rack, place the solder balls into the grid, and ensure that there is a grid for each grid. After the solder balls, the solder balls are collected and the plates are removed.
6. Remove the steel BGA from the base to be baked and complete the ball.
The steps for the "solder paste" + "tin ball" method are as follows.
Basically the same as the first method, the steps "3" and "4" are combined into one step. The solder paste is applied with a brush and applied directly to the BGA pads without stencil printing.