PCBA assembly quality control
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PCBA assembly quality control
(1) Selection of magnification for magnification assist device
As one of the simplest ways to perform manual inspection checks, inspectors often need to use a variety of magnifying tools to view component solder joints and more in more detail. Specify the range of magnification required to amplify the auxiliary device (magnifying glass, microscope, etc.) and establish some basic magnification guidelines based on checking the PCBA pad width and other conditions There is. The main reason for these guidelines is to avoid excessive testing caused by excessive amplification.
(2) Solder paste inspection
Solder paste printing is a quality key process in the SMT placement process of PCBA assemblies. Solder paste printing is a complex process that requires a well-defined and properly implemented process monitoring strategy and manages the process. At least manually check the coverage area and measure the thickness, but it is best to use automatic coverage, thickness, and volume measurement. Solder paste inspection equipment includes a simple 3X magnifier, a solder paste thickness gauge using optical or laser thickness measurement, and an expensive automated online solder paste tester.
In order to effectively control the quality of SMT assembly welds, there are a significant number of defects generated during the printing process to prevent defective assemblies from entering subsequent production steps of SMT placement.
(3) Dispensing inspection
Dot size is also important for patch curing. As with solder paste printing, keeping the process under control requires a well-defined and well-implemented process monitoring strategy. It is recommended to use manual inspection of the adhesive spot.
(4) Solder joint inspection
The quality of solder joints is the basis for the reliability of PCBA products. Solder joints should be regularly analyzed and evaluated to monitor welding and visual inspection to meet requirements. X-ray inspection AXI is an excellent tool for controlling and adjusting the process parameters of wave soldering and reflow soldering.