Problems and improvement methods in wave soldering operation2

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Problems and improvement methods in wave soldering operation2

10. Green residue GREEN RESIDUE:

Green is usually caused by corrosion, especially electronic products, but not completely, because it is difficult to tell whether it is green rust or other chemical products, but in general, green substances should be detected as warnings, and the cause must be identified immediately, especially this. Green matter will get bigger and bigger, so pay attention to it, usually it can be improved by cleaning.

10-1. Corrosion problems usually occur on bare copper or copper-containing alloys. Non-rosin fluxes are used. The corrosive substances contain copper ions and are therefore green. When this green corrosion is found, it can be proved that Not cleaned properly after using non-rosin flux.

10-2.COPPER ABIETATES is a compound of copper oxide and ABIETIC ACID (the main component of rosin). This substance is green but not corrosive and has high insulation. It does not affect the quality but the customer will not agree to clean it.

10-3. The residue or substrate of PRESURFATE is made of similar residue. After the solder, green residue will be produced. The substrate manufacturer should be required to clean the substrate after cleaning to ensure the cleanliness of the substrate.

11. White corrosion

The eighth item is that the white residue refers to the white residue on the substrate, and this item refers to the white corrosion on the part foot and the metal, especially on the metal with more lead components. Mainly because chloride ions easily form lead chloride with lead and then form lead carbonate (white corrosives) with carbon dioxide.

When using rosin-based flux, rosin is insoluble in water and will contain chlorine-containing active agent without corrosive. However, if improper solvent is used, only rosin can be removed to remove chlorine ions, which will accelerate corrosion.

12. Pinholes and Pores PINHOLDS AND BLOWHOLES:

The difference between the pinhole and the air hole. The pinhole is a small hole found in the solder joint. The air hole is the larger hole on the solder joint to see the inside. The inside of the pinhole is usually empty, and the air hole is completely ejected from the internal air. The large hole is caused by the fact that the solder is solidified when the gas has not been completely eliminated, and this problem is formed.

12-1. Organic contaminants: The substrate and the parts of the parts may generate gas and cause pinholes or pores. The source of the pollution may come from the automatic planter or the storage condition is poor. This problem is simpler, but it can be washed with solvent, but If the contaminant is found to be SILICONOIL because it is not easily cleaned by solvents, other alternatives should be considered in the process.

12-2. The substrate has moisture: if the substrate material is cheaper, or the rough drilling method is used, moisture is easily absorbed at the through hole, and the high heat is evaporated during the soldering process. The solution is to put it on. Roast in the oven at 120 ° C for two hours.

12-3. Brightener in electroplating solution: When electroplating with a large amount of brightener, the brightener is often deposited simultaneously with gold, and is volatilized when exposed to high temperature. Especially when gold plating, the electroplating solution containing less brightener is used instead. Of course, this should be returned to the supplier.

13.TRAPPED OIL:

Oxidation prevents the oil from being blown into the tin bath and is ejected by the jet to contaminate the substrate. This problem should be caused by the solder bath surface being too low and the solder in the tin bath can be improved.

14. Solder joints are dark:

This phenomenon is divided into two types (1) after a period of soldering, (about half a year to one year) the color of the solder joints turns dark.

(2) The finished solder joints produced are gray.

14-1. Impurities in solder: The metal content in the solder must be checked regularly every three months.

14-2. Flux will also produce some degree of dark color on hot surfaces. If RA and organic acid flux remain on the solder joint for too long, it will cause slight corrosion and be grayish, immediately after soldering. Cleaning should be improved.

Some inorganic acid fluxes cause ZINC OXYCHLORIDE to be washed with 1% hydrochloric acid and then washed.

14-3. In solder alloys, solder joints with low tin content (such as 40/60 solder) are also dark.

Wave soldering titanium claw

15. Solder joint surface roughness:

The surface of the solder joint has a sand-like protruding surface, and the overall shape of the solder joint does not change.

15-1. Crystallization of metal impurities: Metal components in solder must be inspected regularly every three months

15-2. Tin slag: The tin slag is pushed into the tin bath by PUMP and sprayed through the jet. Because the tin slag is contained in the tin, the surface of the solder joint has a sand-like protrusion. The tin bath surface should be too low, and the solder bath should be too low. Additional soldering should be improved by cleaning the tin bath and PUMP.

15-3. Foreign substances: such as raw edges, insulating materials, etc. hidden in the parts of the feet, will also produce rough surface

16. Yellow solder joints:

Because the solder temperature is too high, immediately check the tin temperature and the temperature controller is faulty.

17. Short circuit BRIDGING:

Excessive solder joints cause two solder joints to meet.

17-1. The substrate is not enough for tin, the preheating is insufficient, #123; the whole tin furnace can be.

17-2. Poor flux: improper flux, deterioration, etc.

17-3. The direction of the substrate is poorly matched with the tin wave, and the tin direction is changed.

17-4. Poor circuit design: too close between lines or contacts (should have a spacing of 0.6mm or more); if it is an array of solder joints or ICs

, should consider the stray solder pad, or use the word white paint to distinguish, the white paint thickness should be 2 times the thickness of the pad (golden road).

17-5. Contaminated tin or excessive accumulation of oxides caused by short circuit on PUMP should be cleaned of the tin furnace or more completely update the solder in the tin bath