PCB production process
Oct 24, 2019| Stay Charging Safely with SChitec
PCB production process
Second, the material
Purpose: According to the requirements of the engineering data MI, cut into small pieces of production plates on large sheets that meet the requirements. Small pieces of paper that meet customer requirements.
Third, drilling
Purpose: According to the engineering data, the required aperture is drilled at the corresponding position on the sheet of the required size.
Process: stacking pin → upper plate → drilling → lower plate → inspection \ repair
Fourth, sink copper
Purpose: The copper is deposited by chemical deposition on the walls of the insulating holes.
Five, graphics transfer
Purpose: Graphic transfer is the transfer of images on the production film to the board
Sixth, graphic plating
Purpose: Graphic plating is to electroplat a layer of copper on the exposed copper skin or hole wall to the required thickness of the copper layer and the required thickness of gold or tin.
Seven, unwinding
2. Objective: Retreat the anti-plating coating layer with NaOH solution to expose the non-line copper layer.
Eight, etching
Purpose: Etching is the use of chemical reaction method to corrode the copper layer in non-line parts.
Nine, green oil
Purpose: Green oil transfers the pattern of green oil film to the board to protect the line and


