PCB production FAQ

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PCB production FAQ

First, degreasing (temperature 60-65 ° C)

1. There are many foams: The quality of the foam is abnormal: it will cause poor degreasing effect. Cause: Mismatched tank solution.

2, there are particulate matter composition: there are particulate matter composition reasons: the filter is bad or the high pressure water washing of the grinding machine is insufficient, the outside brings dust.

3, finger prints can not remove oil: finger prints can not remove oil reasons: low oil temperature, syrup mismatch.

Second, micro-etching (NPS 80-120G / L H2SO4 5% temperature 25-35 ° C)

1. The copper surface of the board is slightly white: the reason is that the grinding plate, degreasing or pollution, the concentration of the syrup is low.

2, the surface of the copper plate is black: after degreasing, the water is not cleaned by oil removal. The pink surface of the copper is a normal effect of micro-etching.

Third, activation (the color of the bath is black, the temperature can not exceed 38 ° C, can not breathe)

1. Precipitation and clarification of the bath:

The reason for the precipitation of the bath:

(1) The concentration of water palladium is added immediately and the content is low (normal pre-dip solution is applied to the liquid level)

(2) The Sn2+ concentration is low, the Cl- content is low, and the temperature is too high.

(3) Too much introduction of air leads to oxidation of palladium.

(4) It is contaminated by Fe+.

2. A layer of silvery white film appears on the surface of the potion:

A silvery white film appears on the surface of the syrup. Cause: The oxide produced by the oxidation of Pd.

Fourth, speed (processing time 1-2 minutes temperature 60-65 ° C)

1. No copper in the hole: Cause: The accelerated processing time is too long, and Pd is also removed while removing Sn.

2, high temperature Pd is easy to fall off.

5. Chemical copper cylinder liquid is contaminated

Causes of contamination of the drug solution: 1. Insufficient water washing before PTH 2, Pd water is brought into the copper cylinder 3. There is a plate falling out of the tank 4, no long-term frying tank 5, insufficient filtration

Washing: Soak for 10 hours with 10% H2SO4, neutralize with 10% NaOH, and finally rinse with water.

Sixth, the hole wall can not sink copper

Reasons: 1. Poor oil removal effect 2. Insufficient slag removal 3. Excessive slag removal

7. After the thermal shock, the hole copper is separated from the hole wall.

Reasons: 1. In addition to poor slag, poor water absorption of the substrate

Eight, the board has a strip of water

Reasons: 1. The design of the hanger is not reasonable. 2. The mixing of the sinking copper cylinder is excessive. 3. The washing is not sufficient after the acceleration.

Nine, the temperature of the chemical copper solution

If the temperature is too high, the chemical copper liquid will be rapidly decomposed, and the composition of the solution will change to affect the quality of the electroless copper plating. High temperatures also produce large amounts of copper powder, causing copper on the board and holes. Generally controlled at around 25-35 °C.