Brief introduction of smart phone power management IC (1)

Shenzhen Shenchuang Hi-tech Electronics Co., Ltd(SChitec) is a high tech enterprise which specialized in phone accessories production and sales. Our main products include travel chargers, car chargers, USB cables, power banks and other digital products.All products are safe and reliable, with unique styles.products pass certificates like CE,FCC,ROHS,UL,PSE,C-Tick,etc,  If you are interested in, you can contact ceo@schitec.com directly.

Stay Charging Safely with SChitec

Brief introduction of smart phone power management IC (1)

At present, there is a power management IC (PMIC), or power management unit (PMU), in most smartphones. It is a kind of special purpose integrated circuit, whose function is to manage the power supply for the main system. PMU undertakes most of the power supply tasks and some other unit functions, such as interface or audio. Some market leading analog semiconductor manufacturers provide customized, semi customized and / or standard devices of PMU. The power management IC structure is shown below.

1. Low pressure differential linear regulator

In most smart phones, 5-12 independent low-voltage differential linear regulators (LDOS) are generally used. Such a large number of LDOS does not mean that the same number of voltage specifications exist in the terminal, but because LDOS are also used as on / off switches with a certain PSRR to prevent noise coupling. Most of the LDOS are integrated in the PMU, but sometimes individual separated LDOS are used. This is mainly due to the layout / wiring of PCB, some special components (such as voltage controlled oscillator) are too sensitive to noise, or used to drive some non-standard units, such as integrated digital camera, etc.

For a long time, the 150maldo encapsulated in SOT-23 is the best choice for these discrete (separated) power supplies. At present, some of the latest IC products adopt new packaging, new submicron processing technology and advanced design scheme, which can provide higher performance with smaller size. Now we can get SOT-23 package of single 300maldo or two 150maldo devices, or micro SC-70 package of single 120almado, with standard version and ultra-low noise (RMS value 10 μ V, 85dbpsrr) version devices. In addition, the more advanced chip level package (UCSP ™) provides the smallest possible size, while QFN package allows the largest chip size to be installed in a 3mm × 3mm area plastic package, while providing higher heat transfer capability. QFN package can achieve higher current LDO, and more LDOS can be packaged in each package, which can contain 3-5 LDOS, which reduces the difference between the separation scheme and PMU.

Power management has increasingly become a strategic competitive advantage, especially in communication, computing and industrial applications. With the continuous development of FPGA and SOC, designers add a large number of mixed signal functions in the next generation of embedded systems, which can achieve system level performance that previously could not be matched.